Hexagonal boron nitride (h‐BN), an insulating 2D layered material, has recently attracted
tremendous interest motivated by the extraordinary properties it shows across the fields of …

The electrical resistance of interconnect wires increases with decreasing size, causing
signal delay and energy consumption that limits further downscaling of integrated circuits …

A major challenge for the continued downscaling of integrated circuits is the resistivity
increase of Cu interconnect lines with decreasing dimensions. Alternative metals have the …

Understanding the structural stability of transition-metal dichalcogenides is necessary to
avoid surface/interface degradation. In this work, the structural stability of 2H-MoTe2 with …

The barrier layer in Cu technology is essential to prevent Cu from diffusing into the dielectric
layer at high temperatures; therefore, it must have a high stability and good adhesion to both …

As the challenges in continued scaling of the integrated circuit technology escalate every
generation, there is an urgent need to find viable solutions for both the front-end-of-line …

Graphene has recently been attracting considerable interest because of its exceptional
conductivity, mechanical strength, thermal stability, etc. Graphene-based devices exhibit …

Integrated circuits (ICs) are challenged to deliver historically anticipated performance
improvements while increasing the cost and complexity of the technology with each …

This study demonstrates molybdenum disulfide (MoS2) as a superior candidate as a
diffusion barrier and liner. This research explores a newly developed process to show how …

Copper interconnects in modern integrated circuits require a barrier layer to prevent Cu
diffusion into surrounding dielectrics. However, conventional barrier materials like TaN are …