A multilayer organic package with 64 dual-polarized antennas for 28GHz 5G communication

X Gu, D Liu, C Baks, O Tageman… - 2017 IEEE MTT-S …, 2017 - ieeexplore.ieee.org
An organic-based multi-layered phased-array antenna package for a 28GHz 5G radio
access applications is hereby introduced. The package incorporates 64 dual-polarized …

An enhanced 64-element dual-polarization antenna array package for W-band communication and imaging applications

X Gu, D Liu, C Baks, JO Plouchart… - 2018 IEEE 68th …, 2018 - ieeexplore.ieee.org
An organic-based multi-layered phased-array antenna package for 94-GHz radar imaging
and communication applications is hereby introduced. The package incorporates 64 dual …

TSV-last integration to replace ASIC wire bonds in the assembly of x-ray detector arrays

JO Hicks, D Malta, D Bordelon, D Richter… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
This paper will describe the use of through-silicon vias (TSVs) in a readout application-
specific integrated circuit (ASIC) chip to replace wire bonds in the assembly of cadmium zinc …

Three-dimensional pipeline ADC utilizing TSV/design optimization and memristor ratioed logic

N Mirzaie, A Alzahmi, H Shamsi… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
High-performance, low-power-consumption, and high-accuracy analog-to-digital converters
(ADCs) with a compact area are necessary for a wide range of current applications. This …

Improved Signal Integrity at 64 Gbps in a 130-nm SiGe Optical Receiver With Through-Silicon Vias

G Movaghar, J Liu, J Dalton… - 2022 IEEE BiCMOS …, 2022 - ieeexplore.ieee.org
This paper provides a comparative study of packaging features of a high-speed silicon-
germanium (SiGe) integrated circuit (IC). Two variants of a 64-Gb/s optical receiver (ORX) …

A wideband phased array antenna with grating lobe cancellation

JCS Chieh, S Das, SK Sharma - 2021 IEEE International …, 2021 - ieeexplore.ieee.org
This paper presents a new type of wideband phased array antenna, which allows for greater
than 0.5 λ inter-elemental spacing, while cancelling and mitigating the effects of the grating …

Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers

Y Sun, Y Jin, T Lian, S Ma, Y Yang… - 2020 IEEE 70th …, 2020 - ieeexplore.ieee.org
In this study, we present a Q-band patch antenna with an underling cavity integrated on the
stacked high-resistivity Si interposers. A process is developed and sample is fabricated …

Thermal resistance analysis for a high power 3D integrated RF Module based on TSV interposer

X Hu, S Ma, D Gong, M Wang, Y Jin… - 2019 IEEE 21st …, 2019 - ieeexplore.ieee.org
This paper proposed a three-dimensional integrated RF transceiver module based on high
resistivity Si interposer embedded with microchannel for on-site heat dissipation. It's …

Integrated design of active phased array for low‐altitude detection radar

H Wang, J Ding, Y Shi, J Zhang, S Quan… - The Journal of …, 2019 - Wiley Online Library
This article presents an integrated design of active phased array for low‐altitude detection
radar. Integrated design is an important method to realise miniaturisation and low cost. The …

All-in-one wafer-level solution for mmic automatic testing

X Ding, Z Wang, J Liu, M Zhou, W Chen, H Chen, J Mo… - Electronics, 2018 - mdpi.com
In this paper, we present an all-in-one wafer-level solution for MMIC (monolithic microwave
integrated circuit) automatic testing. The OSL (open short load) two tier de-embedding, the …