Copper electrodeposition on copper from still plating solutions of different compositions was
investigated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry …

A highly porous copper foam with 3-dimensionally interconnected pores was made by an
electrodeposition technique utilizing hydrogen bubbles, generated concurrently with copper …

Electrochemical behaviors of the base electrolyte containing different additives were
investigated by galvanostatic potential transient measurements (GM), cyclic voltammetry …

As studies of suppression during copper electrodeposition have typically involved
polyethylene glycol (PEG), a deposition study was undertaken varying the chemistry of the …

Pulsing electrolysis is a method to produce high purity nano copper powder. Effect of 5
organic additives, polyvinylpyrrolidone (PVP), sodium dodecyl sulfate (SDS), polyethylene …

Electrodeposition of acid copper plating on mild steel substrate is tedious due to the
galvanic displacement reaction of copper on mild steel. This can be avoided by using a …

This paper proposes a novel mathematical model for the formation of spatio-temporal
patterns in electrodeposition. At variance with classical modelling approaches that are …

We investigate the behavior of Cu plating bath suppressor additives poly (ethylene
glycol)(PEG) and poly (propylene glycol)(PPG) using normal Raman spectroscopy, surface …

The surface adsorption behavior of polyethyleneglycols (PEG), a wide-used additive in
damascene copper plating, was investigated in acidic Cu2+-free electrolyte in the presence …

This paper deals with the behaviour of 3-diethylamino-7-(4-dimethylaminophenylazo)-5-
phenylphenazinium chloride (Janus Green B, JGB) during Cu electrodeposition from an …