Material removal characteristics of full aperture optical polishing process
Precision surfaces of optical grade have been in great demand for various applications such
as high-power laser systems, astronomical reflecting telescopes glass mirrors, folding …
as high-power laser systems, astronomical reflecting telescopes glass mirrors, folding …
Microscopic removal function and the relationship between slurry particle size distribution and workpiece roughness during pad polishing
T Suratwala, M Feit, W Steele, L Wong… - Journal of the …, 2014 - Wiley Online Library
Various ceria and colloidal silica polishing slurries were used to polish fused silica glass
workpieces on a polyurethane pad. Characterization of the slurries' particle size distribution …
workpieces on a polyurethane pad. Characterization of the slurries' particle size distribution …
Study on electrolytic reduction with controlled oxygen flow for iron from molten oxide slag containing FeO
YM Gao, B Wang, SB Wang, S Peng - Journal of Mining and …, 2013 - doiserbia.nb.rs
A ZrO2-based solid membrane electrolytic cell with controlled oxygen flow was constructed:
graphite rod/[O] Fe+ C saturated/ZrO2 (MgO)/(FeO) slag/iron crucible. The feasibility of …
graphite rod/[O] Fe+ C saturated/ZrO2 (MgO)/(FeO) slag/iron crucible. The feasibility of …
Frictional characteristic of polymeric additive for the slurry of chemical mechanical planarization process
H Kim, JC Yang, J Lee, SH Park, J Won… - ECS Journal of Solid …, 2012 - iopscience.iop.org
In this study, we analyzed the coefficient of friction (COF) of film surface and pad interface
during the wafer polishing process to make a correlation with the existence of polyelectrolyte …
during the wafer polishing process to make a correlation with the existence of polyelectrolyte …
Ceria nanoparticles synthesized by a polymer precursor method
We report a novel synthesis technique of ceria nanoparticles by a sol-gel type chemical
process using poly-vinyl alcohol (PVA) as a capping as well as a reducing agent. The as …
process using poly-vinyl alcohol (PVA) as a capping as well as a reducing agent. The as …
Evaluation of Point-Of-Use (POU) Filters Performance in Chemical Mechanical Polishing Slurry Supply System
S Jang, H Kim, H Jin, M Nam, A Kulkarni… - Particle and aerosol …, 2013 - koreascience.kr
The chemical mechanical polishing (CMP) process is widely used in semiconductor
manufacturing process for planarization of various materials and structures. Point-of-use …
manufacturing process for planarization of various materials and structures. Point-of-use …
Unraveling Key Mechanistic Interactions Relevant to Pre-and Post-chemical Mechanical Planarization Processes
T Zubi - 2019 - search.proquest.com
A detailed understanding of the chemical mechanical planarization (CMP) process is
needed in order to optimize both chemical and mechanical actions that focus on improving …
needed in order to optimize both chemical and mechanical actions that focus on improving …
Computational analysis and chemical mechanical polishing for manufacturing of optical components
NY Nguyen - 2017 - dr.ntu.edu.sg
High precision optical components are required for modern life and future. To achieve
component's surfaces with high quality, chemical mechanical polishing (CMP) is required. It …
component's surfaces with high quality, chemical mechanical polishing (CMP) is required. It …