The effect of nanoparticle shape on the thermal resistance of a flat-plate heat pipe using acetone-based Al2O3 nanofluids

HJ Kim, SH Lee, SB Kim, SP Jang - International Journal of Heat and Mass …, 2016 - Elsevier
In this paper, we experimentally investigate the effect of the shape of nanoparticles in
acetone-based Al 2 O 3 nanofluids on the thermal resistance of a flat-plate heat pipe …

Optimization study on the uniform temperature of an additively manufactured cooler for a semiconductor heating device

SY Lee, KW Kim, DH Kim, MS Yang, JW Kim… - Applied Thermal …, 2023 - Elsevier
A semiconductor heating device is the core component of the apparatus used for testing
semiconductor dies. It is important to heat semiconductor dies at a uniform temperature. The …

Numerical evaluation on surface temperature uniformity of multi-zone and single-zone ceramic heaters with the electrostatic chuck

HJ Lee, SH Lee - Journal of Mechanical Science and Technology, 2021 - Springer
The present study aims to numerically analyze the surface temperature uniformity of the
multi-zone/single-zone ceramic heaters because the temperature uniformity becomes …

Evaluation of surface temperature uniformity of multi-zone ceramic heaters with embedded cooling channels for electrostatic chuck

KH Jang, HJ Lee, SH Lee - Journal of Mechanical Science and …, 2022 - Springer
Electrostatic chuck (ESC) is used to transport and fix semiconductors during semiconductor
processing effectively. In addition, the wafer is heated and cooled by the ESC to control its …

Optimization study of a probe chuck for semiconductor wafers using genetic algorithm and deep reinforcement learnings

G Choi, SA Aodu, IS Park - Journal of Mechanical Science and …, 2024 - Springer
The probe chuck is an inspection device assessing the thermal durability of semiconductor
wafers in various temperature environments before shipping. It is most important to ensure …

Effect of heat source area on the thermal resistance of the wick columns vapor chambers

S Wiriyasart, P Naphon - Journal of Mechanical Science and Technology, 2016 - Springer
The results of the spreading thermal resistance, heat transfer and flow characteristics of the
vapor chamber embedded with plate fin are investigated. The experiments are performed …

Thermal modelling and design of dynamically-controlled heater plates for high temperature processing of 300 mm wafers

DS Woo, C Han, BD Youn, KJ Kim - Journal of Mechanical Science and …, 2019 - Springer
The temperature uniformity of heater plates (HPs) should be sustained due to critical
dimension uniformity and robust operation in high temperature processing of 300 mm …

Packaging effects on the sensing performance of RTDs on an AlN substrate of a wafer heater

NS Effendi, KJ Kim - Journal of Mechanical Science and Technology, 2021 - Springer
This study investigates packaging effects on the sensing performance of resistance
temperature detectors (RTDs) on an AlN substrate of a wafer heater. The study utilizes a …

New encapsulation method using low-melting-point alloy for sealing micro heat pipes

C Li, X Wang, C Zhou, Y Luo, Z Li, S Li - Journal of Mechanical Science …, 2017 - Springer
This study proposed a method using Low-melting-point alloy (LMPA) to seal Micro heat
pipes (MHPs), which were made of Si substrates and glass covers. Corresponding MHP …

[PDF][PDF] Effect of AlF₃ addition to the plasma resistance behavior of YOF coating deposited by plasma-spraying method (플라즈마-스프레이법에의해코팅한옥시불화 …

YJ Kim, JH Park, S beom Yu, S Jeong… - Journal of the Korean …, 2023 - koreascience.kr
In order to manufacture a semiconductor circuit, etching, cleaning, and deposition processes
are repeated. During these processes, the inside of the processing chamber is exposed to …