Accurate dynamic 3D deformation measurement based on the synchronous multiplexing of polarization and speckle metrology
An accurate dynamic 3D deformation measurement method realized by the combination of
phase-shifting speckle interferometry and speckle correlation is proposed. By converting the …
phase-shifting speckle interferometry and speckle correlation is proposed. By converting the …
Dynamic three-dimensional deformation measurement by polarization-multiplexing of full complex amplitude
This paper provides an extensive discussion of a complex amplitude-based dynamic three-
dimensional deformation measurement method, in which the phase and amplitude of the …
dimensional deformation measurement method, in which the phase and amplitude of the …
Use of specklegrams background terms for speckle photography combined with phase-shifting electronic speckle pattern interferometry
R Zemmamouche, JF Vandenrijt… - Optical …, 2015 - spiedigitallibrary.org
Electronic speckle pattern interferometry (ESPI) is combined with digital speckle
photography (DSP) to measure out-of-plane deformation in the presence of large in-plane …
photography (DSP) to measure out-of-plane deformation in the presence of large in-plane …
[HTML][HTML] Out-of-plane deformation measurements of an aluminium plate during quasi-static perforation using structured light and close-range photogrammetry
F Grytten, E Fagerholt, T Auestad, B Førre… - International Journal of …, 2007 - Elsevier
An optical system using structured light and close-range photogrammetry for full-field
continuous measurements of the out-of-plane deformation of a metal plate loaded at its …
continuous measurements of the out-of-plane deformation of a metal plate loaded at its …
Measurement of out-of-plane deformation by combination of speckle photography and speckle shearing interferometry
B Barrientos, RA Martínez-Celorio, LM López… - Optik, 2004 - Elsevier
We measure the derivative of out-of-plane deformation in presence of large in-plane rigid
body displacement (RBD) by a combination of Electronic Speckle-Shearing Pattern …
body displacement (RBD) by a combination of Electronic Speckle-Shearing Pattern …
[HTML][HTML] Quantifying Microplastic Leaching from Paper Cups: A Specklegram Image Analytical Approach
MA Rithwiq, P Anju Abraham, MNS Swapna… - Photonics, 2024 - mdpi.com
The study proposes a novel speckle interferometric method for detecting and quantifying
microplastic leaching from paper cups, addressing concerns raised by the World Health …
microplastic leaching from paper cups, addressing concerns raised by the World Health …
Nanoscale displacement measurement of MEMS devices using fiber optic interferometry
In this paper, the application of fiber interferometry in the nano-scale displacement
measurement of microelectromechanical system (MEMS) device is being presented. Fiber …
measurement of microelectromechanical system (MEMS) device is being presented. Fiber …
A simple method for artworks monitoring by simultaneous speckle interferometry (ESPI) and speckle photography
C Daffara, S Mazzocato, T de Rubeis… - Optics for Arts …, 2021 - spiedigitallibrary.org
In this paper, a method for artworks monitoring is proposed, able to perform simultaneously
speckle interferometry and speckle photography, thus the system can map both out-of-plane …
speckle interferometry and speckle photography, thus the system can map both out-of-plane …
Signal-to-noise based local decorrelation compensation for speckle interferometry applications
J Molimard, R Cordero, A Vautrin - Applied optics, 2008 - opg.optica.org
Speckle-based interferometric techniques allow assessing the whole-field deformation
induced on a specimen due to the application of load. These high sensitivity optical …
induced on a specimen due to the application of load. These high sensitivity optical …
Thermally-induced warpage measurement on small packages by a microscopic fringe projection system
J Pan, DA Zwemer, G Petriccione… - … on Phenomena in …, 2006 - ieeexplore.ieee.org
Existing techniques for measuring thermomechanical warpage of electronic component
packages run into limitations when the package size falls below 10 mm on a side. This …
packages run into limitations when the package size falls below 10 mm on a side. This …