Electronic devices need to work at high temperature in some fields for a long time, peculiarly
step soldering technology, primary packaging and flip–chip connections, etc., along with the …

Minor alloying addition to solders has been an important strategy to improve the integrity
and reliability of Pb-free solders joint. In this study, the effects of 0.06 Ni and 0.5 Sb additives …

Full implementation of the new generation of lead-free solders requires detailed knowledge
and understanding of their mechanical behavior. This paper reports on structure, thermal …

This study investigates the effect of adding 0.5 wt% ZnO nanoparticles into Sn–5 wt% Sb–
0.5 wt% Cu (SSC505) solder alloy on the growth of intermetallic compounds (IMCs) as well …

Small amounts of Ni were added to Sn-5.0 Sb-0.5 Cu (SSC505) solder alloy. The added Ni
slightly increased the melting temperature and slightly reduced the melting range of the …

Considerable effort is being made to develop lead-free solders for assembling in
environmental-conscious electronics, due to the inherent toxicity of Pb. The search for …

As a non-volatile semiconductor memory technology, phase-change memory has a wide
range of application prospects as a result of the excellent comprehensive performance. In …

An experimental investigation has been conducted with respect to the influence of
permanent magnet stirring (PMS) under different rotation speeds (0, 60, 120, 180 rpm) on …

Abstract Sn–5 wt% Sb–0.5 wt% Cu (plain SSC505) and Sn–5 wt% Sb–0.5 wt% Cu–0.5 wt%
ZnO (SSC-ZnO) composite solder alloys have been studied. The variation in thermal …

Abstract Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat
dissipation in power electronics. However, despite the necessary thermal connection …