Aim of the research was to examine the effectiveness of various methods to remove moisture
from printed circuit boards (PCBs) depending on PCB's type and process parameters. The …

The superiority of stress sensors over temperature sensors for detecting defects in solder
joints was investigated. The effects of joint defects on device stress and temperature in a …

Moisture has been one of the major concerns for package designers and reliability
researchers. It is well-known that high humidity combined with high temperature can cause a …

Plastic Ball Grid Array (PBGA) technology has been proven to be one of the most popular
packaging solutions with many advantages in thermo-electro-mechanical performance …

Polymer materials have been widely used in electronic packaging with many advantages
such as: lower cost, light weight and good performance. They however suffer a major …

RESUMO A indústria de semicondutores caracteriza-se pela sua rápida evolução
tecnológica, o que cria a necessidade de desenvolver soluções disruptivas e produtos …

Electronic packages absorb moisture when exposed to uncontrolled humid conditions
during manufacturing processes and service life. At high temperatures, the effects of …