(57) ABSTRACT A MEMS and a method of manufacturing MEMS compo nents are provided.
The method includes providing a MEMS wafer stack including a top cap wafer, a MEMS …

An integrated MEMS system having a MEMS chip, includ ing a MEMS transducer, and at
least one IC chip, including MEMS processing circuitry, and additional circuitry to pro cess …

A package includes a support structure having an electrically insulating material, a
microelectromechanical system (MEMS) component, a cover structure having an electrically …

7,017,410 7,040,163 7,043,985 7,056,757 7,093,486 7,100.448 7,104,129 7,138,694
7,159,441 7,168,318 7,176,556 7,180,019 7,210,351 7,217,588 7,238,999 7,247,246 …

An electronic package includes a die mounted on a first substrate; a second substrate
disposed over the first substrate; a pillar wall extending between a surface of the die and an …

A MEMS motion sensor and its manufacturing method are provided. The sensor includes a
MEMS wafer including a proof mass and flexible springs suspending the proof mass and …

A three dimensional (3D) micro-electro-mechanical system (MEMS) device is provided. The
device comprises a central MEMS wafer, and top and bottom cap wafers. The MEMS wafer …

A flow sensor package comprises a chip comprising a sensitive structure for sensing the flow
of a fluid and an encapsulation at least partly encapsulating the chip. A recess in the …

(57) ABSTRACT A micro-electro-mechanical system (MEMS) magnetometer is provided for
measuring magnetic field components along three orthogonal axes. The MEMS …

A semiconductor device includes a microelectromechanical system (MEMS) die, a lid, and
an integrated circuit die. The lid is over the MEMS die and defines a cavity between the lid …