Nowadays, the local heat accumulation of electronic components not only restricts the
further miniaturization and integration of electronic devices but also seriously affects the …

The purpose of this review article is to summarize previous research works done on polymer
composites filled with various types of nitride compounds for potential applications, specially …

In this research project, the hexagonal boron nitride@(silver/copper)(h-BN@(Ag/Cu))
hybrids are successfully synthesized through a jointly decorated two-step process in this …

Abstract Two-dimensional (2D) boron nitride nanosheets (BNNS), with exceptional
thermoconductive properties and wide band gap, hold a great promise as candidate fillers …

Abstract 2D materials are a very up‐and‐coming class of additives in the field of polymer
composites due to their versatility and exceptional intrinsic properties. This enables …

Epoxy resin has been extensively used in the electrical systems and electronic devices.
However, it is still a challenge to fabricate highly thermally conductive but electrically …

Hexagonal boron nitride (h-BN) has been widely investigated in the field of thermal interface
materials (TIMs) due to its unique physicochemical properties, including high thermal …

In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN
particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were …

It is challenging to fabricate polymer composites with high thermal conductivity at a low
concentration of fillers. In this work, Polyethylene (PE)/Poly (vinylidene …

The addition of fillers with high thermal properties to polymer matrices increases the thermal
conductivity of the composites in comparison with pure polymers. In the literature, various …