Growth characterization of intermetallic compounds at the Cu/Al solid state interface
H Ma, K Ren, X Xiao, R Qiu, H Shi - Materials Research Express, 2019 - iopscience.iop.org
Cu/Al cold-rolled composite plates were annealed in the temperature range of 573∼ 773 K.
The growth mechanism of intermetallic compounds formed at the Cu/Al solid-state interface …
The growth mechanism of intermetallic compounds formed at the Cu/Al solid-state interface …
Effect of annealing method and applied stress on aging behavior of copper-aluminum bimetals
M Jahangiri, A Bajgholi, A Fallah… - Journal of Alloys and …, 2020 - Elsevier
The purpose of this study was to investigate the effect of aging method and the presence or
absence of external stress on the aging behavior of Cu/Al diffusion couples. For this …
absence of external stress on the aging behavior of Cu/Al diffusion couples. For this …
[PDF][PDF] Al/Cu 复合材料制备中理论与工艺研究进展
李慧， 龙萍， 牛永胜， 黄斐荣， 杨斌 - 材料导报, 2016 - maxmould.net
摘要Al/Cu 复合材料具有质轻, 导电良好和成本低等优点, 成为了近年来研究的热点.
介绍了Al/Cu 复合材料的主要界面复合理论, 并着重阐述了近年来对主流理论的研究 …
介绍了Al/Cu 复合材料的主要界面复合理论, 并着重阐述了近年来对主流理论的研究 …
Comprehensive study of changes in the phase composition of copper-aluminum conductors during heating
AY Pariyskaya, AV Mokryak… - Journal of Physics …, 2022 - iopscience.iop.org
Abstract Changes in the microstructural characteristics and phase composition of copper
plated conductors CCA-20 in the temperature range of 100-600 C were studied by XRD and …
plated conductors CCA-20 in the temperature range of 100-600 C were studied by XRD and …
XXI ВЕК: ИТОГИ ПРОШЛОГО И ПРОБЛЕМЫ НАСТОЯЩЕГО ПЛЮС
ОМ НАЗАРОВА, МК САЙФЕТДИНОВА… - XXI ВЕК: ИТОГИ …, 2022 - elibrary.ru
В настоящей статье представлены результаты реализованного социально-
психологического исследования в форме анкетирования по вопросу относительно …
психологического исследования в форме анкетирования по вопросу относительно …