The development of new adhesives has allowed to expand the application of bonding into
the most diverse industrial fields. This review article presents the commonly used …

Printed board assemblies, ie components soldered on printed circuit boards (PCBs), are
exposed to thermal cycles responsible for fatigue cracking of solder joints as a result of …

A mesoscale numerical model based on shear transformation zone (STZ) theory is
implemented in a commercial finite element software. The model is designed to predict the …

Soft adhesives used in cutting-edge technological fields are susceptible to shear fatigue
failure under complex in-plane loadings. Although the interaction or coupling effect between …

The subject of mechanical metamaterials has been gaining significant attention, however,
their widespread application is still halted. Such materials are usually considered as stand …

Dynamic response under blasting is significantly different from these under impacts, as an
important factor of response law crack length has been paid less attention. In order to …

This study investigates the fracture onset and crack deflection in multi-material adhesive
joints with thick bond-lines (≈ 10 mm) under global mode I loading. The role of adherend …

The fracture resistance of adhesive joints depends on the bondline thickness, especially in
the toughest systems. While increasing the adhesive thickness to operate at peak fracture …

Control of the in-situ polymerization of thick methacrylic laminates is essential to minimize
cavitation due to monomer boiling. To this end, a computationally efficient thermochemical …

This study is an extension of previously developed models of plasticity occurring in the
vicinity of​​ a longitudinal crack in a thin elastic-plastic layer sandwiched between two …