Simultaneous transfer and bonding (SITRAB) process for Micro-LEDs using laser-assisted bonding with compression (LABC) process and SITRAB adhesive
KS Choi, J Joo, YS Eom, GM Choi… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
The transfer process of moving individual micro-LED chips to a display substrate has been
regarded as the biggest technical obstacle for the commercialization of displays based on …
regarded as the biggest technical obstacle for the commercialization of displays based on …
Laser-assisted bonding with compression (LABC) based tiling bonding technology, enabling technology for chiplet integration
KS Choi, J Joo, GM Choi, C Lee… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Chiplet integration technology is already being used to effectively develop SoCs optimized
for custom applications. The method can also practically solve the yield problems of …
for custom applications. The method can also practically solve the yield problems of …
Development of digital signage modules composed of mini-LEDs using laser-assisted bonding (LAB) technology
KS Choi, J Joo, K Jang, YS Eom… - 2020 IEEE 70th …, 2020 - ieeexplore.ieee.org
Light-emitting diodes (LED) based displays are highlighted because of their interesting
features compared with others. Especially, the LED display with active matrix (AM) has …
features compared with others. Especially, the LED display with active matrix (AM) has …
Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch
There are many technical issues regarding chiplet integration. For example, there are
technical concerns about how to obtain clean and reliable solder cap surfaces, Cu RDL and …
technical concerns about how to obtain clean and reliable solder cap surfaces, Cu RDL and …
Interconnection Reliability of Mini LEDs for Display Applications
IS Kye, J Joo, GM Choi, C Lee, KS Jang… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
Micro/Mini-LED displays have many advantages compared to other displays. However, the
reliability data required for the commercialization of mini-LEDs is insufficient. In this study …
reliability data required for the commercialization of mini-LEDs is insufficient. In this study …
MicroLED Transfer, Bonding, and Bad Pixel Repair Technology
KS Choi, YS Eom, SH Moon, HG Yun… - Electronics and …, 2022 - koreascience.kr
MicroLEDs have various advantages and application areas and are in the spotlight as next-
generation displays. Nevertheless, the commercialization of microLEDs is slow because of …
generation displays. Nevertheless, the commercialization of microLEDs is slow because of …
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs
M Yao, N Zhao, D Yu, Z Xiao… - 2018 19th International …, 2018 - ieeexplore.ieee.org
Wafer-level hybrid bonding and through silicon vias (TSVs) are key technologies to fabricate
3D IC products with ultra-fine pitch bumps and high interconnects density. In this work …
3D IC products with ultra-fine pitch bumps and high interconnects density. In this work …