This article proposes a computational fluid dynamics (CFD)-based machine learning (ML)
model to set the temperature of a convection reflow oven and control conveyor speed. Due …

As surface mount components shrink in size, smaller apertures on stencils during solder
paste printing can lead to uneven solder volume on a single resistor. This can result in the …

Purpose This paper aims to propose a method to quickly set the heating zone temperatures
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …

The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This
exponential growth has led to research and development of co-packaged optics (CPO) …

As surface-mounted components get smaller, especially passive components such as chip
resistor or chip capacitor, small apertures on a stencil are required, which generates higher …

Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

This study introduces a novel method for expeditiously configuring the heating zone
temperatures and conveyor speed of a reflow oven, particularly for thick PCBs with bulky …

The interconnections and chips of the internal components of electronic devices need to be
protected to prevent damage during shipping, handling, and daily use. This article studied …

Residual stress has been a big concern during the fabrication and assembly which may
damage the electronic device or shorten the device's lifetime. Several methods have been …

This study is aimed to find correlation between the fatigue life and solder joint shape with
respect to component location in experimental and numerical approaches. The test vehicle …