A boron etch-stop assisted lateral silicon etching process for improved high-aspect-ratio silicon micromachining and its applications
J Hsieh, W Fang - Journal of Micromechanics and …, 2002 - iopscience.iop.org
High-aspect-ratio micromachining (HARM) developed in recent years has made many
devices more versatile compared to the surface micromachining process, but it has also met …
devices more versatile compared to the surface micromachining process, but it has also met …
[PDF][PDF] Análise eletromecânica do giroscópio MEMS
AHR Ferreira - 2013 - repositorio.unicamp.br
Este trabalho apresenta uma análise dos problemas físicos associados ao projeto de um
sensor inercial giroscópio baseado na tecnologia MEMS (micro-electro-mechanical …
sensor inercial giroscópio baseado na tecnologia MEMS (micro-electro-mechanical …
A vertical convex corner compensation and non {111} crystal planes protection for wet anisotropic bulk micromachining process
HY Chu, W Fang - Journal of Micromechanics and …, 2004 - iopscience.iop.org
In general, convex corner structures and non {111} crystal planes will be undercut during
wet anisotropic etching. These characteristics have been extensively exploited to fabricate …
wet anisotropic etching. These characteristics have been extensively exploited to fabricate …