Light-material interaction has received significant attention for wearable electronics because
of its exceptional ability to excite multi-physical, transient, and non-equilibrium photon …

Solder joint, crucial component in electronic systems, face significant challenges when
exposed to extreme conditions during applications. The solder joint reliability involving …

Until now, electronic packages have been manufactured using the conventional convection
reflow process. However, it is becoming challenging to apply the reflow process because it …

Intense pulsed light (IPL) soldering is investigated as an alternative soldering process to
conventional reflow soldering. IPL soldering is suitable for achieving a carbon‐neutral …

In this study, the properties of solder joints were compared after bonding process using
different energy sources. Various soldering methods were employed, including reflow, laser …

The effects of the sintering duration and powder fraction (Ag-coated Cu/SnAgCu) on the
microstructure and reliability of transient liquid phase sintered (TLPS) joints are investigated …

Hybrid solder joints incorporating the Sn-3.0 Ag-0.5 Cu/Sn–58Bi structure have been
studied to tackle challenges such as warpage, thermal degradation, and excessive …

In this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes
with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation …

Electronic packaging has been miniaturized for high density and performance. Therefore,
the formation of reliable interconnections has become an important issue. However, the …

Embedded-chip planar silver-elastomer interconnect technology is developed with flexible
substrates and demonstrated for on-skin biophotonic sensor applications. This approach …