Challenges and opportunities for high-power and high-frequency AlGaN/GaN high-electron-mobility transistor (HEMT) applications: A review

M Haziq, S Falina, AA Manaf, H Kawarada, M Syamsul - Micromachines, 2022 - mdpi.com
The emergence of gallium nitride high-electron-mobility transistor (GaN HEMT) devices has
the potential to deliver high power and high frequency with performances surpassing …

[HTML][HTML] β-Gallium oxide power electronics

AJ Green, J Speck, G Xing, P Moens, F Allerstam… - Apl Materials, 2022 - pubs.aip.org
Gallium Oxide has undergone rapid technological maturation over the last decade, pushing
it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the …

Applications and impacts of nanoscale thermal transport in electronics packaging

RJ Warzoha, AA Wilson… - Journal of …, 2021 - asmedigitalcollection.asme.org
This review introduces relevant nanoscale thermal transport processes that impact thermal
abatement in power electronics applications. Specifically, we highlight the importance of …

Controlling surface/interface states in GaN-based transistors: Surface model, insulated gate, and surface passivation

JT Asubar, Z Yatabe, D Gregusova… - Journal of Applied …, 2021 - pubs.aip.org
Controlling surface/interface states in GaN-based transistors: Surface model, insulated gate,
and surface passivation | Journal of Applied Physics | AIP Publishing Skip to Main Content …

[HTML][HTML] A perspective on the electro-thermal co-design of ultra-wide bandgap lateral devices

S Choi, S Graham, S Chowdhury, ER Heller… - Applied Physics …, 2021 - pubs.aip.org
Fundamental research and development of ultra-wide bandgap (UWBG) semiconductor
devices are under way to realize next-generation power conversion and wireless …

A review of thermoreflectance techniques for characterizing wide bandgap semiconductors' thermal properties and devices' temperatures

C Yuan, R Hanus, S Graham - Journal of Applied Physics, 2022 - pubs.aip.org
Thermoreflectance-based techniques, such as pump–probe thermoreflectance (pump–
probe TR) and thermoreflectance thermal imaging (TTI), have emerged as the powerful and …

Near-junction phonon thermal spreading in GaN HEMTs: A comparative study of simulation techniques by full-band phonon Monte Carlo method

Y Shen, HA Yang, BY Cao - International Journal of Heat and Mass …, 2023 - Elsevier
Accurate thermal simulation is essential for the near-junction thermal management and
electro-thermal co-design of GaN HEMTs. While various methods have been employed to …

[HTML][HTML] Electro-thermal co-design of β-(AlxGa1-x) 2O3/Ga2O3 modulation doped field effect transistors

B Chatterjee, Y Song, JS Lundh, Y Zhang, Z Xia… - Applied Physics …, 2020 - pubs.aip.org
Ultra-wide bandgap β-gallium oxide (Ga 2 O 3) devices are of considerable interest with
potential applications in both power electronics and radio frequency devices. However …

Bias dependence of non-Fourier heat spreading in GaN HEMTs

Y Shen, XS Chen, YC Hua, HL Li… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
In this article, self-heating in gallium nitride (GaN) high-electron-mobility transistors (HEMTs)
is studied by combining the technology computer-aided design (TCAD) and phonon Monte …

[HTML][HTML] Thermal design of multi-fin Ga2O3 vertical transistors

B Chatterjee, W Li, K Nomoto, HG Xing… - Applied Physics …, 2021 - pubs.aip.org
Ultra-wide bandgap β-gallium oxide (Ga 2 O 3) vertical device technologies are of significant
interest in the context of the development of next-generation kV-range power switching …