The growing demand toward miniaturization and power device packaging required new die‐
attach materials with high thermal conductivity (TC). Multitudinous attention is being paid to …

The internet of things and growing demand for smaller and more advanced devices has
created the problem of high heat production in electronic equipment, which greatly reduces …

We report on the investigation of thermal transport in noncured silicone composites with
graphene fillers of different lateral dimensions. Graphene fillers are comprised of few-layer …

The extraordinary opto-electronic and mechanical properties of Graphene makes it a
popular material for several applications. However, defects like: cracks, and voids are …

The thermo-mechanical properties of four various structures of BC2N are investigated using
molecular dynamics (MD) simulation. These structures show superior mechanical …

We provide a summary of the fundamentals of thermal management, outline the state-of-the-
art in the field of thermal interface materials, and describe recent developments in graphene …

We perform a numerical evaluation on the multi-physical field coupling effect to improve the
interfacial thermal conductivity (ITC) of Gr/h-BN (Graphene/Hexagonal boron nitride) planar …

Synthesis of multi-layered nanostructures has led to better management of the heat transfer
at the nanoscale. There are several parameters that affect this phenomenon, among them …

Present study focuses on the interfacial thermal resistance (ITR) and mechanical properties
of hybrid C3N–BC3 structure utilizing molecular dynamics (MD) simulation. According to the …

The mechanical properties and interfacial thermal resistance (ITR) of hybrid BC6N-BC2N
structure are studied via molecular dynamics (MD) simulation. Different vacancy atoms type …