Challenges facing copper‐plated metallisation for silicon photovoltaics: Insights from integrated circuit technology development
Copper‐plated interconnects were widely adopted for volume manufacture of integrated
circuits after more than a decade of intensive research to demonstrate that use of Cu would …
circuits after more than a decade of intensive research to demonstrate that use of Cu would …
Degradation of plated silicon solar module due to copper diffusion: The role of capping layer formation and contact adhesion
Copper plating can provide significant cost savings over screen printed Ag for industrially
produced Si photovoltaic modules, however concerns exist with regard to the durability of …
produced Si photovoltaic modules, however concerns exist with regard to the durability of …
Plated metal adhesion to picosecond laser-ablated silicon solar cells: Influence of surface chemistry and wettability
This study investigated the influence of UV picosecond laser fluence, used to ablate the SiN
x antireflection coating for Ni/Cu/Ag plated p-type Si solar cells, on busbar and finger …
x antireflection coating for Ni/Cu/Ag plated p-type Si solar cells, on busbar and finger …
Untangling the mysteries of plated metal finger adhesion: understanding the contributions from plating rate, chemistry, grid geometry, and sintering
X Wang, PC Hsiao, W Zhang… - IEEE Journal of …, 2016 - ieeexplore.ieee.org
Historically, busbar pull tests have been used as a measure of metal–silicon adhesion for
silicon solar cells; however, such measurements cannot be easily applied to evaluate finger …
silicon solar cells; however, such measurements cannot be easily applied to evaluate finger …
Improved metal adhesion with galvanic nickel plating to silicon solar cells
Nickel galvanic displacement (NiGD) plating to silicon surfaces allows for the deposition of
self-limiting sub-micron nickel layers. This paper reports the use of NiGD plating as an …
self-limiting sub-micron nickel layers. This paper reports the use of NiGD plating as an …
Towards a more reliable manufacturing future–Automatic classification of failure modes during adhesion testing of silicon solar cells
Busbar pull tests are the generally accepted method of measuring metal-silicon adhesion for
silicon solar cells. However, this method cannot be used to measure metal finger adhesion …
silicon solar cells. However, this method cannot be used to measure metal finger adhesion …
Microcharacterization of Interface Oxide Layer on Laser-Structured Silicon Surfaces of Plated Ni–Cu Solar Cells
Light-induced plating on laser-structured passivation layer openings is an alternative
method to silver screen printing for fabrication of the front-side metal grid on silicon solar …
method to silver screen printing for fabrication of the front-side metal grid on silicon solar …
Post-plating annealing of light induced plated copper fingers: Implications for reliable metallization
Light-induced plating (LIP) of Ni/Cu presents a potentially lower-cost alternative to screen-
printed Ag for silicon solar cell metallization. This paper presents results of self-annealing …
printed Ag for silicon solar cell metallization. This paper presents results of self-annealing …
Optimized Adhesion of Plated Silicon Solar Cell Contacts by F2‐Based Dry Atmospheric Pressure Nano‐Roughening
The adhesion of a plated layer on a substrate is increased by an appropriate roughness at
the interface. The paper reports on plated Ni‐Cu‐Ag contacts for silicon solar cells deposited …
the interface. The paper reports on plated Ni‐Cu‐Ag contacts for silicon solar cells deposited …
[PDF][PDF] Plated Metallisation for Silicon Solar Cells: A Deeper Dive into the Importance of Contact Adhesion
B Phua - 2022 - unsworks.unsw.edu.au
Electrical contact formation is required for the transport of generated current from solar cells.
Currently, Ag screen printing is the dominant metallisation method, but it accounts for~ 60 …
Currently, Ag screen printing is the dominant metallisation method, but it accounts for~ 60 …