Having a 1D material like Multiwall Carbon Nanotube (MWCNT) as a potential candidate for
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …

The emerging VLSI technology and simultaneously highly dense packaging of devices and
interconnects in nano-scale chips have prosperously enabled realization of system-on-chip …

The state-of-the-art development and subsequent miniaturization of technologies in e-
systems such as computers and digital communication systems have led to densely and …

Aluminium was a primary material for interconnection in integrated circuits (ICs) since their
inception. Later, copper was introduced as interconnect material which has better metallic …

Due to advancements in device scaling in very-large-scale integration (VLSI) technology,
signal integrity (SI) issues play a major role to determining the performance of on-chip …

This study explores the potential of randomly mixed carbon nanotube bundle (RMCB) as a
viable on-chip interconnect. Achieving high-quality carbon nanotubes (CNTs) with uniform …

This typescript focuses on unraveling the functional performance deterioration issues related
to conventional Cu on‐chip nanointerconnecting wires; mainly occurred due to the shrinking …

In the present work, for examining the performance of dielectric inserted side contact
multilayer graphene nano ribbon (DSMLGNR), a novel Unconditionally Stable Finite …

With the feasibility to scale the devices and interconnects in highly sophisticated VLSI
technology, the demand for high-speed and low-power e-applications have also …

Modern VLSI devices are manufactured using deep submicron technology. On-chip
interconnects represent a major performance bottleneck for high-speed VLSI architectures …