Controlling interfacial reactions and intermetallic compound growth at the interface of a lead-free solder joint with layer-by-layer transferred graphene
The immoderate growth of intermetallic compounds (IMCs) formed at the interface of a
solder metal and the substrate during soldering can degrade the mechanical properties and …
solder metal and the substrate during soldering can degrade the mechanical properties and …
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage
M Berthou, P Retailleau, H Frémont… - Microelectronics …, 2009 - Elsevier
This paper describes a reliable and reproducible method to reveal the microstructure of lead-
free solder joints. This method is then used to follow the aging of lead free assembled chip …
free solder joints. This method is then used to follow the aging of lead free assembled chip …
High speed digital image correlation for transient-shock reliability of electronics
Electronics may be subjected to shock, vibration, and drop-impact during shipping, handling
and during normal usage. Measurement of transient dynamic deformation of the electronics …
and during normal usage. Measurement of transient dynamic deformation of the electronics …
Fatigue properties of lead-free doped solder joints
The reliability of an electronic assembly is limited by a fatigue failure of one of the
interconnected solder joints. Fatigue properties of the common lead free solder joints have …
interconnected solder joints. Fatigue properties of the common lead free solder joints have …
High-speed solder ball shear and pull tests vs. board level mechanical drop tests: correlation of failure mode and loading speed
This study compares high-speed bondtesting (shear and pull) with board level drop testing
(BLDT) of BGA packages using Sn4. 0% Ag0. 5% Cu solder balls and either an ENIG or …
(BLDT) of BGA packages using Sn4. 0% Ag0. 5% Cu solder balls and either an ENIG or …
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints
Abstract Cu 6 Sn 5 and Cu 3 Sn are common intermetallic compounds (IMCs) found in Sn–
Ag–Cu (SAC) lead-free solder joints with OSP pad finish. People typically attributed the …
Ag–Cu (SAC) lead-free solder joints with OSP pad finish. People typically attributed the …
Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests
This study investigated brittle solder joint failure mechanisms during high-speed solder ball
shear and pull testing. BGA package samples with different solder alloys (Sn4. 0% Ag0. 5 …
shear and pull testing. BGA package samples with different solder alloys (Sn4. 0% Ag0. 5 …
[PDF][PDF] 电子封装跨尺度凸点结构Sn3. 0Ag0. 5Cu/Cu 微互连焊点界面IMC 生长与演化及力学行为的尺寸效应
周敏波， 赵星飞， 陈明强， 柯常波， 张新平 - 机械工程学报, 2022 - qikan.cmes.org
针对目前无铅电子封装中主流应用的Sn3. 0Ag0. 5Cu 钎料, 研究了其直径为600~ 60 µm
的焊球在开孔型Cu 基底(焊盘) 上260℃ 恒温回流不同时间(10~ 300 s) 形成跨尺度凸点结构 …
的焊球在开孔型Cu 基底(焊盘) 上260℃ 恒温回流不同时间(10~ 300 s) 形成跨尺度凸点结构 …
Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn–Cu solder or solid Sn–Cu solder at 222° C: Experimental results …
OY Liashenko, F Hodaj - Acta Materialia, 2015 - Elsevier
Interfacial reactions between a Cu substrate and a metastable supercooled liquid Sn–Cu
solder at 222° C are studied for the first time. The principal aim of this study is to compare the …
solder at 222° C are studied for the first time. The principal aim of this study is to compare the …
Recent Advances in Fine Pitch Cu Pillar Bumps for Advanced Semiconductor Packaging
EC Noh, HW Lee, JW Yoon - Journal of the Microelectronics and …, 2023 - koreascience.kr
Recently, as the demand for high-performance computers and mobile products increases,
semiconductor packages are becoming high-integration and high-density. Therefore, in …
semiconductor packages are becoming high-integration and high-density. Therefore, in …