Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni
The influence of Ni on the size and twinning of primary Cu 6 Sn 5 crystals in Sn-0.7 Cu-0.05
Ni and Sn-xCu (x= 0.7, 0.9, 1.1)(mass%) solder joints is studied using synchrotron …
Ni and Sn-xCu (x= 0.7, 0.9, 1.1)(mass%) solder joints is studied using synchrotron …
[HTML][HTML] Size effects on IMC growth of Cu/Ni/Sn-3.5 Ag microbump joints during isothermal aging and prediction of shear strength using ANN
C Tang, Z Chen, M Fang, X Xiao, G Chen… - Journal of Materials …, 2022 - Elsevier
Significant downsizing trend is currently directing the advanced microelectronic packaging
industry, which poses new challenges to the manufacturing process and reliability of high …
industry, which poses new challenges to the manufacturing process and reliability of high …
[HTML][HTML] Grain refinement of primary Cu6Sn5 in the Sn-3wt% Ag-5wt% Cu alloy by Ge
Fine grain structure is generally favoured in the alloy system. Here, we demonstrate that the
fine intermetallic compounds (IMCs) in Sn-3wt% Ag-5wt% Cu (SAC35) alloy by coupling …
fine intermetallic compounds (IMCs) in Sn-3wt% Ag-5wt% Cu (SAC35) alloy by coupling …
Enhancing performance of Sn–Ag–Cu alloy through germanium additions: Investigating microstructure, thermal characteristics, and mechanical properties
The conflict between strength and ductility has been a longstanding dilemma for metallic
alloys. In this study, we introduce an innovative approach to significantly improve the overall …
alloys. In this study, we introduce an innovative approach to significantly improve the overall …
Effects of vanadium on the properties of Sn-3wt% Ag-5wt% Cu solder alloy
The present study explores the effects of minor vanadium (V) addition on Sn-3wt% Ag-5wt%
Cu (SAC35) based solder alloy. Weight percentages of V ranging from 0 to 0.15 wt% were …
Cu (SAC35) based solder alloy. Weight percentages of V ranging from 0 to 0.15 wt% were …
Impact reliability analysis of a rigid-flex PCB system under acceleration loads
B Zhang, G Shan, F Su - Microelectronics Reliability, 2021 - Elsevier
The dynamic response of a microsystem based on rigid-flex printed circuit board (rigid-flex
PCB) with three layers of rigid circuit boards connected by flexible circuits was investigated …
PCB) with three layers of rigid circuit boards connected by flexible circuits was investigated …
[PDF][PDF] Phase formation and solid solubility in high reliability Pb-free solders containing Bi, Sb or In
SA Belyakov, B Arfaei, C Johnson, K Howell… - Proceedings of …, 2019 - researchgate.net
ABSTRACT Sn-Ag-Cu (SAC) solders generally have better thermal cycling performance
than eutectic Sn-Pb. However, their performance deteriorates significantly as the harshness …
than eutectic Sn-Pb. However, their performance deteriorates significantly as the harshness …
The effect of Ni and Bi additions on the solderability of Sn-0.7 Cu solder coatings
The present investigation explores the influence of Ni and Bi on the solderability of Sn-0.7
Cu solder coatings. The minor addition of 0.05 wt.% Ni into the Sn-0.7 Cu solder alloy results …
Cu solder coatings. The minor addition of 0.05 wt.% Ni into the Sn-0.7 Cu solder alloy results …
Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework
Laser rework (LR) and hot air rework (HR) process impact on the nearby ball grid array
(BGA) rework components with lead-free solder Sn3. 0Ag0. 5Cu (SAC305) solder joints …
(BGA) rework components with lead-free solder Sn3. 0Ag0. 5Cu (SAC305) solder joints …
Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly
Abstract The lead-free Sn-0.4 Ag-0.5 Cu (SAC405) solder arrays provides an
interconnection between the electronic package and printed circuit board (PCB) of the …
interconnection between the electronic package and printed circuit board (PCB) of the …