Methods for hybrid bonding include depositing and patterning a dielectric layer on a
substrate to form openings in the dielectric layer, depositing a barrier layer over the dielectric …

Layer structures for making direct metal-to-metal bonds at low temperatures and shorter
annealing durations in microelectronics are provided. Example bonding interface structures …

2018-02-20 Assigned to INVENSAS BONDING TECHNOLOGIES, INC. reassignment
INVENSAS BONDING TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST …

(57) ABSTRACT A structure can include a first element and a carrier bonded to the first
element along an interface. A waveguide can be defined at least in part along the interface …

Representative techniques and devices including process steps may be employed to
mitigate the potential for delamination of bonded microelectronic substrates due to metal …

(57) ABSTRACT A bonded structure can include a first element having a first interface
feature and a second element having a second interface feature. The first interface feature …

Systems and methods for efficient transfer of elements are disclosed. A film which supports a
plurality of diced inte grated device dies can be provided. The plurality of diced integrated …

US11195748B2 - Interconnect structures and methods for forming same - Google Patents
US11195748B2 - Interconnect structures and methods for forming same - Google Patents …

A stacked and electrically interconnected structure is disclosed. The structure can comprise
a first element and a second element directly bonded to the first element along a bonding …

A stacked and electrically interconnected structure is disclosed. The stacked structure can
include a first element comprising a first contact pad and a second element comprising a …