Sn–Zn solder alloys have been considered as one of the more attractive lead-free solders
since it can easily replace Sn–Pb eutectic alloy without increasing the soldering …

The growth kinetics of Cu5Zn8 phase has been investigated under long-term thermal
exposure conditions using single shear lap joints. The Cu5Zn8 phase was formed by …

The microstructure and intermetallic phase growth in solder joints of photovoltaic modules
are investigated because of their significance for interconnection reliability. Interconnector …

This paper investigates the effects of reaction time and temperature on the morphology and
growth mechanism of intermetallic compound (IMC) layers of plain Sn–8Zn–3Bi solder and …

Varying amounts of Zn (1, 3, and 7 wt%) were added to Sn–3.5 Ag solder on a Cu pad, and
the resultant solder joint microstructures after a reflow and isothermal aging (150° C, up to …

The present study aims to clarify the impact of Cu addition and aging conditions on the
microstructure development and mechanical properties of Sn-9Zn binary eutectic alloy. The …

In view of the recent technological as well as legislational developments, more reliability
challenges are encountered at all interconnection levels in electronic applications. With …

This work investigates the influence of an Ag nanoparticle addition on the microstructure,
microhardness, creep, temperature-dependent elastic properties, damping capacity, and …

This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-
3.5 Ag, Sn-4.0 Ag-0.5 Cu, Sn-8.6 Zn and Sn-8.55 Zn-0.5 Ag-0.1 Al-0.5 Ga lead-free solders …

Wetting balance method is used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions
on the solderability of Sn–9Zn lead-free solders, results show that the optimal addition …