A system for processing wafers in a vacuum processing chamber. Carrier comprising a
frame having a plurality of openings, each opening configured to accommodate one wafer. A …

Solar cells in accordance with the present invention have reduced ohmic losses. These cells
include photo-receptive regions that are doped less densely than adjacent selective emitter …

Alternative methods of fabricating an interconnect structure in which an enhanced diffusion
barrier including an in-situ formed metal nitride liner formed between an interconnect …

METHODS,” co-pending US. Provisional Application Ser. No. 61/133,028,? led Jun. 24,
2008, entitled “SOLAR CELL FABRICATION WITH FACETING AND IMPLANTA TION,” and …

The first process tool is configured to perform a first fabrica tion process on the
semiconductor device. The first data col lection unit is configured to collect fabrication data …

(52) US Cl. A method of ion implantation comprising: providing a USPC.................... 257/715:
438/513; 257/E21. 334-0 plasma within a plasma region of a chamber, positively bias (58) …

Alternative methods of fabricating an interconnect structure in which an enhanced diffusion
barrier including an in-situ formed metal nitride liner formed between an interconnect …

(57) ABSTRACT A system for treating flammable effluent gas is provided. The system
includes an exhaust conduit to carry the flammable effluent gas to an abatement unit, a …

(57) ABSTRACT A method of controlling surface non-uniformity of a Wafer in a polishing
operation includes (a) providing a model for a Wafer polishing that de? nes a plurality of …

In one aspect of the present invention, an adjustable shadow mask implantation system
comprises: an ion Source configured to provide ions; and an shadow mask assembly …