Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging
J Song, D Zhang, X Chen, S Hu, X Zhao, CC Lee… - Materials …, 2024 - Elsevier
Transient liquid phase (TLP) bonding technique is one of the promising solutions to third-
generation wide-bandgap semiconductor power packaging. However, its prolonged heating …
generation wide-bandgap semiconductor power packaging. However, its prolonged heating …
Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding
AA Vlasov, T Uusitalo, H Virtanen… - IEEE Photonics …, 2023 - ieeexplore.ieee.org
Current development trends concerning miniaturizing of electronics and photonics systems
are aiming at assembly and 3D co-integration of a broad range of technologies including …
are aiming at assembly and 3D co-integration of a broad range of technologies including …
Characterization of laser beams: theory and application in laser-assisted bonding process
WA Braganca Jr, KO Kim - Optical Engineering, 2021 - spiedigitallibrary.org
The International Organization for Standardization (ISO), in collaboration with the academic
community, has developed and published a comprehensive system of standards for the …
community, has developed and published a comprehensive system of standards for the …
Laser-assisted bonding approach for photonic integration processes
AA Vlasov, T Uusitalo, E Lepukhov… - 2023 24th European …, 2023 - ieeexplore.ieee.org
Current development trends concerning miniaturizing of electronics and photonics systems
are aiming at assembly and 3D co-integration of a broad range of technologies including …
are aiming at assembly and 3D co-integration of a broad range of technologies including …
A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging
S Hu, J Song, Y Liu, C Wu, T Lei, A Ge… - IEEE Transactions …, 2024 - ieeexplore.ieee.org
In this article, we propose a thermal gradient mechanism-based laser-assisted bonding (TG-
LAB) process, which can be used for the hermetic package of thermally sensitive …
LAB) process, which can be used for the hermetic package of thermally sensitive …
A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging
J Song, S Hu, Y Liu, A Ge, D Zhang… - 2022 23rd …, 2022 - ieeexplore.ieee.org
Infrared (IR) detection systems were widely used in civilian applications, such as medical
diagnosis, remote surveillance and rescue assistance. A good hermetic package protects …
diagnosis, remote surveillance and rescue assistance. A good hermetic package protects …
Research on Longitudinal Ultrasonic Vibration Assisted Flip Chip Bonding Process
D Liu, J Qiao, L Li, Z Qiao, B Zhou… - 2024 25th International …, 2024 - ieeexplore.ieee.org
The current flip-chip bonding technology still faces defects such as surface thermal burnout
of chips due to excessively high process temperature and significant mechanical stress …
of chips due to excessively high process temperature and significant mechanical stress …