As water‐saturated polymer networks, hydrogels are a growing family of soft materials that
have recently become promising candidates for flexible electronics application. However, it …

Traditional chemical mechanical polishing (CMP) usually employs more than three kinds of
toxic or corrosive ingredients for its slurry. Quartz glass is a hard-brittle solid, and it is …

Improving the material removal rate (MRR) of silicon wafers is a challenge in chemical
mechanical polishing (CMP), to meet the demands of the development of integrated circuits …

It is a challenge to enhance the material removal rate (MRR) during the chemical
mechanical polishing (CMP) of silicon wafers, with increasing the size of a wafer and …

Background Chemical-mechanical planarization (CMP) is the most important process in the
semiconductor industry, as it affects the product manufacturing yield. Of the several factors …

Abstract Chemical Mechanical Polishing (CMP) is a widely used surface treatment process
in integrated circuit manufacturing for global planarization of the surface layers of various …

Single crystal silicon wafers are widely applied in the field of Integrated Circuits (ICs).
However, in order to pursue high surface quality and efficient material removal rate (MRR) …

The final polishing of silicon results in the irresistible formation of micro-defects (ie, particle
residues and scratches) on the surface. In view of this problem, the synergistic effect of …

Atomic surface of silicon (Si) wafers is highly desired for integrated circuit (IC) industry. To
meet this demand, traditional chemical mechanical polishing usually employs noxious …

In this study, the synthesis of CeO 2 abrasives by two-step method was studied in detail and
compared with one-step method. The micro-morphology, particle size and distribution of …