Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading

Thermal aging study of encapsulated power devices under autonomous driving condition and its effect on board level reliability

YH Yang, B Han, P Gromala - 2023 IEEE 73rd Electronic …, 2023 - ieeexplore.ieee.org
This study presents an investigation of the effect of thermal aging of encapsulated power
devices under autonomous driving conditions on the board level reliability. An activation …
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