Copper current collectors (Cu CCs) impact the production technology and performance of
many electrochemical devices by their unique properties and reliable operation. The …

The ability to efficiently and reliably transfer heat between sources and sinks is often a
bottleneck in the thermal management of modern energy conversion technologies ranging …

The utilization of a hierarchical microstructure and three-dimensional (3D) manifold for liquid
delivery and liquid/vapor extraction could potentially improve the single-phase/two-phase …

Phase change materials (PCMs) provide a high energy density for thermal storage systems
but often suffer from limited power densities due to the low PCM thermal conductivity. Much …

Delivering liquid through the void spaces in porous metals is a daunting challenge for a
variety of emerging interface technologies ranging from battery electrodes to evaporation …

Thermal management in power electronics relies on active and passive cooling devices that
use porous copper structures. However, these critical components, such as sintered copper …

We here present an approach to cooling of electronics requiring dissipation of extreme heat
fluxes exceeding 1 kW/cm2 over∼ 1 cm2 areas. The approach applies a combination of …

Ultra-thin heat pipes are extensively used to address heat dissipation challenges in compact
electronic devices with limited space. Research on new types of micro-porous wick is crucial …

Microporous metals are used extensively for applications that combine convective and
conductive transport and benefit from low resistance to both modes of transport …

Controlling the thermal conductivity of semiconductors is of practical interest in optimizing
the performance of thermoelectric and phononic devices. The insertion of inclusions of …