This article proposes a miniature 3-D system in package (SIP) design of the four-channel RF
transceiver. The key advancement is the demonstration of 3-D stacking of silicon carriers …

Taking advantage of good hermeticity, tiny parasitic capacitance, batch mode fabrication,
and compatibility with multiple bonding techniques, the glass-silicon composite substrate …

As the short vertical interconnections can significantly shorten the interconnect length
between different circuits, three‐dimensional integrated circuits (3D ICs) based on the …

In the future, electronic system is developing towards higher integration density, higher
performance and higher working frequency. Traditional integration and packaging …

Based on the TSV technology, a compact passive resonator utilizing spiral inductor and
coaxial TSV capacitor is proposed. And the compact stack configuration integrates the whole …

This thesis focuses on integration technology research and development for a healthcare
monitoring and vain viewer device called Smart Skin Display as a Flexible Hybrid …