Quantum‐Engineered Devices Based on 2D Materials for Next‐Generation Information Processing and Storage

A Pal, S Zhang, T Chavan, K Agashiwala… - Advanced …, 2023 - Wiley Online Library
As an approximation to the quantum state of solids, the band theory, developed nearly
seven decades ago, fostered the advance of modern integrated solid‐state electronics, one …

Two-dimensional materials enabled next-generation low-energy compute and connectivity

A Pal, K Agashiwala, J Jiang, D Zhang, T Chavan… - MRS Bulletin, 2021 - Springer
Since the invention of the metal–oxide–semiconductor field-effect transistor (MOSFET) in
late 1959, the impact of electronics on human society has been increasingly pervasive …

[HTML][HTML] Selecting alternative metals for advanced interconnects

JP Soulié, K Sankaran, B Van Troeye… - Journal of Applied …, 2024 - pubs.aip.org
Interconnect resistance and reliability have emerged as critical factors limiting the
performance of advanced CMOS circuits. With the slowdown of transistor scaling …

Electrical modeling and characterization of graphene-based on-chip spiral inductors

DW Wang, MJ Yuan, JY Dai, WS Zhao - Micromachines, 2022 - mdpi.com
This paper investigates the electrical performance of graphene-based on-chip spiral
inductors by virtue of a physics-based equivalent circuit model. The skin and proximity …

Machine learning techniques for modeling and performance analysis of interconnects

JN Tripathi, H Vaghasiya, D Junjariya… - IEEE Open Journal of …, 2021 - ieeexplore.ieee.org
Interconnects are essential components of any electronic system. Their design, modeling
and optimization are becoming complex and computationally expensive with the evolution of …

Performance and reliability improvement in intercalated MLGNR interconnects using optimized aspect ratio

B Kumari, R Sharma, M Sahoo - Scientific Reports, 2022 - nature.com
In this work, aspect ratio of various intercalation doped MLGNR interconnects are optimized
using a numerical approach to achieve improved performance and reliability. A numerical …

High-frequency characteristics of multilayer graphene nanoribbon interconnects: Exploring the implications OF SKIN effect

A Upadhyay, MK Rai, R Khanna - Micro and Nanostructures, 2024 - Elsevier
A study is undertaken to explore the frequency-dependent traits of crosstalk delay (XD),
crosstalk noise area (X-NA), and the mean time to failure induced by electromigration (EM …

Future materials for beyond Si integrated circuits: a Perspective

L Colombo, S El Kazzi, M Popovici… - … on Materials for …, 2024 - ieeexplore.ieee.org
The integration of novel materials has been pivotal in advancing Si-based devices ever
since Si became the preferred material for transistors, and later, integrated circuits. New …

Analysis of RC delay using Multi level interconnects

S Aathilakshmi, DM Vaheen, H Vijay… - … on Smart Structures …, 2023 - ieeexplore.ieee.org
Very Large-Scale Integration (VLSI) is a specialized field within the design of integrated
circuits (ICs) in electrical engineering for delay optimization. Among the myriad challenges …

Advances in multilayer graphene processes for metallization and high-frequency devices

K Ueno - Japanese Journal of Applied Physics, 2022 - iopscience.iop.org
Multilayer graphene (MLG) has been proposed as an alternative material for nanometer-
wide interconnects. However, it has not been put to practical use, since the process …