Reliability comparison of aged SAC fine-pitch ball grid array packages versus surface finishes
Pb-free solder joints exposed to elevated isothermal temperatures for prolonged periods of
time undergo microstructural and mechanical evolution, which degrades the joint electrical …
time undergo microstructural and mechanical evolution, which degrades the joint electrical …
Extreme environment reliability of components for computing with SAC305 and alternative high reliability solders
TE Sanders - 2016 - search.proquest.com
The semiconductor and packaging industries have been moving away from the use of Lead
(Pb) due to the increasing awareness of the health and safety concerns surrounding its use …
(Pb) due to the increasing awareness of the health and safety concerns surrounding its use …
Effects on the reliability of lead-free solder joints under harsh environment
Pb-free solder joints undergo microstructural and mechanical evolution due to alloy
coarsening and growing intermetallic compounds which degrade the joint electrical …
coarsening and growing intermetallic compounds which degrade the joint electrical …
Principal components regression model for prediction of life-reduction in SAC leadfree interconnects during long-term high temperature storage
Electronics in military and defense applications may be stored for prolonged period of time
prior to deployment in mission critical applications. In addition, electronics in automotive …
prior to deployment in mission critical applications. In addition, electronics in automotive …
Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future Electronics
MEA Belhadi - 2019 - search.proquest.com
Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future
Electronics by Mohamed El Amine Belhadi A maste Page 1 Mechanical Properties of Micro …
Electronics by Mohamed El Amine Belhadi A maste Page 1 Mechanical Properties of Micro …