Cooling future system-on-chips with diamond inter-tiers
Heat spreading is critical in reducing the overall junction temperature of monolithic system-
on-chips (SoCs) and high-heat-flux radio frequency (RF) applications. Bulk diamond has the …
on-chips (SoCs) and high-heat-flux radio frequency (RF) applications. Bulk diamond has the …
Thermal boundary conductance enhancement of the Si/diamond interface via atomic transition strategy
X Zhao, Y Qu, N Deng, J Yuan, W Hu, Z Zhang… - Surfaces and …, 2025 - Elsevier
Developing multi-chip systems introduces significant thermal management challenges, due
to dense vertical stacking and interconnections. Specifically, the increased number of …
to dense vertical stacking and interconnections. Specifically, the increased number of …
Devices, Materials, Process Technologies, and Microelectronic Ecosystem Beyond the Exit of the Device Miniaturization Tunnel
Many innovations across the system stack–from algorithms and architectures to circuits,
devices, fabrication processes, and materials–will provide large synergistic benefits at the …
devices, fabrication processes, and materials–will provide large synergistic benefits at the …