This paper discusses the development of an extensible programmatic workflow that
leverages evolving technologies in 2D/3D imaging, distributed instrument control, image …

A system and method for imaging a sample having a complex structure (such as an
integrated circuit) implements two modes of operation utilizing a common electron beam …

The rapid progression of semiconductor technology has significantly impacted the ability to
examine and analyze complex integrated circuits (ICs). Small device feature sizes …

(57) ABSTRACT A system and method for imaging a sample having a complex structure
(such as an integrated circuit). The sample is placed on a motion system that moves the …

We report the results of our studies on thermally induced surface topography changes in
ultra-thinned silicon flip-chip packaged devices. Previous results showed that over polishing …

In this paper, we present methods for targeted silicon thinning by contour milling to
overcome challenges associated with thinning large devices to under 5 µm remaining …

Infrared optical probing techniques that have significant applications to and continued
development for silicon physical debug have existed for decades. More recently, resolution …

This tutorial will assist the analyst in making decisions on backside thinning and polishing
requirements and hopefully dispel many of the associated myths and assumptions. Many …

Anticipating the end of life for IR-based failure analysis techniques, a method of global
backside preparation to ultra-thin remaining silicon thickness (RST) has been developed …

Techniques are provided for tomographic imaging with sub-beam resolution and spectral
enhancement. A system implementing the techniques according to an embodiment includes …