Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such
as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF) …

The orientation and distribution of nanotwins were regulated by the addition of gelatin during
direct current electroplating copper films. Columnar grains with vertically orientated …

To understand the size effect on electromigration (EM) behavior in flip chip Pb-free Sn-3.5
Ag solder bumps, EM tests were performed with changes in the pad opening size and solder …

Under the trend of miniaturization of microelectronic devices, the serving environment of
solder joints becomes severer, which requires a higher reliability of materials. To ensure the …

在先进封装中器件小型化的趋势下, 焊点所处的服役环境越加苛刻, 这对焊点材料提出了更高的
可靠性要求. 为保证微小尺寸焊点的可靠性, 具有较强扩散阻挡能力的铁镍 …

The predicted growth behavior of intermetallic compound (IMC) induced by electromigration
of a Cu/organic solderability preservative (OSP)/Sn-2.5 Ag solder/electroless nickel …

Microelectronic packaging technology is developing towards a complex structure with finer
routing layers, which will bring great challenges to the reliability of microelectronic …

Three different substrates with varying (111) textures were used to study the epitaxial growth
behavior of nanotwinned copper (nt-Cu) films during direct current electroplating. The (111) …

To accomplish a high-speed bonding process of dies for the formation of a bondline with
mechanical reliability at high temperatures and excellent thermal conductance, pressure …

The evolution of primary and interfacial intermetallic compounds in solder joints during
electromigration (EM) significantly influences the mechanical properties and reliability of …