Heterogeneous HMC+ DDRx memory management for performance-temperature tradeoffs
Three-dimensional DRAMs (3D-DRAMs) are emerging as a promising solution to address
the memory wall problem in computer systems. However, high fabrication cost per bit and …
the memory wall problem in computer systems. However, high fabrication cost per bit and …
A bandwidth accurate, flexible and rapid simulating multi-HMC modeling tool
P Siegl, R Buchty, M Berekovic - Proceedings of the International …, 2017 - dl.acm.org
Derived by the demand for ever increasing computing performance, a steadily widening
performance gap between memory and processor architectures has emerged. While …
performance gap between memory and processor architectures has emerged. While …
Addressing prolonged restore challenges in further scaling DRAMs
X Zhang - 2017 - search.proquest.com
As the de facto memory technology, DRAM has enjoyed continuous scaling over the past
decades to keep performance growth and capacity enhancement. However, DRAM further …
decades to keep performance growth and capacity enhancement. However, DRAM further …
A Stacked Memory Architecture for Improving Performance and Capacity
이석한 - 2019 - s-space.snu.ac.kr
The advance of DRAM manufacturing technology slows down, whereas the density and
performance needs of DRAM continue to increase. This desire has motivated the industry to …
performance needs of DRAM continue to increase. This desire has motivated the industry to …
[PDF][PDF] Eidesstattliche Erklärung
D speicherintegrierte Verarbeitungsarchitekturen - leopard.tu-braunschweig.de
Eine Promotion ähnelt einer langen Reise in die Ferne. Ferne Ziele gespickt mit
unbekannten Wahrnehmungen erwirken neue Erkenntnisse und inspirierende Einfälle. Auf …
unbekannten Wahrnehmungen erwirken neue Erkenntnisse und inspirierende Einfälle. Auf …
[PDF][PDF] Exploration of DRAM Scaling from Restoring Perspective
X Zhang - 2016 - people.cs.pitt.edu
As a fundamental building block of modern computing systems, it is important for main
memory to achieve short latency, high density, efficient energy and low cost, etc. Owing to …
memory to achieve short latency, high density, efficient energy and low cost, etc. Owing to …