Degradation, damage evolution, and fatigue models in the literature for various engineering
materials, mostly metals and composites, are reviewed. For empirical models established …

Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …

Low-cycle thermal-mechanical fatigue loadings induce progressive and permanent
degradation of mechanical properties of lead-free solder materials, and thus reduce the …

Printed board assemblies, ie components soldered on printed circuit boards (PCBs), are
exposed to thermal cycles responsible for fatigue cracking of solder joints as a result of …

The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …

Electromigration-induced damage, which is in principal an irreversible mass diffusion under
high current density, has been a concern for VLSI design for a long time. Miniaturization of …

Mechanics from its side and thermodynamics from its side consider evolution of complex
systems, including the Universe. Created classical thermodynamic theory of evolution has …

We propose a viscoelastic/plastic constitutive equation for viscoelastic media based on
irreversible thermodynamics and the viscoelastic theory. Uniaxial tensile tests on a TriA-X …

Owing to their superior electrical, thermal, and mechanical properties, solder joints are the
most widely used interconnection materials in electronic product packaging. Because the …

Reliability of solder joints under Electromigration (EM) and Thermomigration (TM) has drawn
increasing attention in recent years, however current understanding regarding degradation …