Structure, principle, and application of magnetic field-assisted pulsed laser deposition: An overview

Y Lu, C Yang, H Wang, L Ma, M Xu, L Xi - Vacuum, 2023 - Elsevier
One of the most significant developments in pulsed laser deposition (PLD) technology is the
introduction of external magnetic fields to affect the generation, expansion, diffusion, and …

Fabrication and applications of the optical diamond-like carbon films: a review

Y Lu, S Wang, G Huang, L Xi, G Qin, M Zhu… - Journal of Materials …, 2022 - Springer
Optical diamond-like carbon films applied in the optical and opto-electronical fields are paid
attention in this review. Based on the reported experimental data during the last decade …

Atomic layer deposited TiO2 nanofilm on titanium implant for reduced the release of particles

X Zhao, X Zhang, Z Zhou, F Meng, R Liu… - … in Bioengineering and …, 2024 - frontiersin.org
Objective: Titanium implants are widely used in surgeries for their biocompatibility and
mechanical properties. However, excessive titanium particle release can cause implant …

Nitrogen Pressure Significantly Impacts Microstructures and Mechanical Properties of CrAlN Coatings Prepared by Pulsed Laser Deposition

Z He, L Liu, J Wang, Z Geng, X Guo, J Peng, W Li… - Ceramics …, 2024 - Elsevier
The effect of nitrogen pressure on the crystalline phase, composition, microstructure, and
mechanical properties of chromium aluminum nitride (CrAlN) coatings prepared by pulsed …

Ceramic-based smart thin films

Y Li, Y He - Advanced Ceramic Coatings for Energy Applications, 2024 - Elsevier
In aerospace, automotive, medical, and construction industries, there is a need to improve
material performance and reliability, achieve adaptive regulation, and reduce energy and …

[PDF][PDF] 纳米银微焊点阵列的超快激光图形化沉积及其芯片封装研究

吴永超, 王帅奇, 郭伟, 刘磊, 邹贵生, 彭鹏 - 机械工程学报, 2022 - qikan.cmes.org
随着集成电路芯片封装向小型化, 集成化方向的不断发展, 无铅锡基钎料性能已不能满足目前
集成电路封装的需求. 本文提出了一种脉冲激光图形化沉积纳米金属颗粒制备小尺寸 …

[PDF][PDF] Patterning Deposition of Nano-sliver Micro Bumps Array by Ultrafast Laser and Its Chip Packaging Research

吴永超, 王帅奇, 郭伟, 刘磊, 邹贵生… - Journal of Mechanical …, 2022 - qikan.cmes.org
With the continuous development of integrated circuit chip packaging in the direction of
miniaturization and integration, the performance of lead-free tin-based solder can no longer …

[PDF][PDF] 激光加工纳米粒子的研究进展与发展趋势(内封面文章· 特邀)

刘辉龙, 肖志文, 甘力天, 郑宇, 陈云, 陈桪, 陈新 - 红外与激光工程, 2024 - researching.cn
纳米粒子材料由于至少有一维处于纳米级尺寸, 使得其在光学, 热学, 电学, 磁学,
力学以及化学等方面展示出许多奇异的特性. 激光加工纳米粒子作为当前一种新兴且高效的材料 …

[引用][C] 全局曲线拟合实现高厚度检测分辨力的结构光照明显微术

杨可君, 刘磊, 冯金花, 谢仲业, 胡松, 唐燕 - Acta Optica Sinica, 2022 - 中国激光杂志社