A composite solder was prepared by adding different amount Ni modified multi-walled
carbon nanotubes (MWCNTs) into the Sn-3.0 Ag-0.5 Cu (SAC305) solder. Experiments were …

Highly conductive Cu–Cu interconnections of SiC die with Ti/Ni/Cu metallization and direct
bonded copper substrate for high-power semiconductor devices are achieved by the low …

The continuous drive for miniaturization and enhanced functionality in micro-electronic
devices demands highly integrated circuit (IC) packaging. This trend leads to a dense …

Copper (Cu) nanoparticle (NP) paste has emerged as a promising choice for future high
power electronics. However, the application of CuNP paste is generally limited because of …

Martian habitats are ideally constructed using only locally available soils; extant attempts to
process structural materials on Mars, however, generally require additives or calcination. In …

Abstract In this work, Cu 6 Sn 5 nanoparticles in dimension of 10 nm are synthesized and
first applied to improve the SnBi solder alloys. The microstructure, tensile properties, creep …

Purpose This paper aims to examine the effects of bonding temperature, bonding time,
bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P …

High-temperature-stable circuit interconnects are highly desirable for the wide band-gap
semiconductor devices to operate in harsh environment (> 200° C). In this study, a full Cu 3 …

Nano-silver has the characteristics of low-temperature sintering and high-temperature
service, which can reduce the thermal stress in the packaging process. Because of the high …

Understanding the mechanisms behind sintering Cu-Ag core–shell nanoparticles can help
us optimize the sintering process parameters and design the core–shell structure to achieve …