Parallel-plate Luneburg lens antenna for broadband multibeam radiation at millimeter-wave frequencies with design optimization
HT Chou, ZD Yan - IEEE Transactions on Antennas and …, 2018 - ieeexplore.ieee.org
This paper presents the implementation of Luneburg lens antenna based on a 2-D parallel-
plate structure for broadband multibeam radiation at millimeter-wave frequencies. In …
plate structure for broadband multibeam radiation at millimeter-wave frequencies. In …
A tri‐band and miniaturized planar antenna based on countersink and defected ground structure techniques
P Moukala Mpele, F Moukanda Mbango… - … Journal of RF and …, 2021 - Wiley Online Library
In this article, a compact planar heart‐shaped antenna based on countersink and partial
ground plane techniques is proposed to operate as a multiband device for modern wireless …
ground plane techniques is proposed to operate as a multiband device for modern wireless …
Effective permittivity of heterogeneous substrates with cubes in a 3-D lattice
CC Njoku, WG Whittow… - IEEE Antennas and …, 2011 - ieeexplore.ieee.org
This letter studies the behavior of heterogeneous dielectric substrates created by including
micro-sized cubes of different electromagnetic (EM) properties to an otherwise homogenous …
micro-sized cubes of different electromagnetic (EM) properties to an otherwise homogenous …
Measurement of axially inhomogeneous permittivity distributions in resonant microwave cavities
R Peter, G Fischerauer - IEEE Transactions on Microwave …, 2019 - ieeexplore.ieee.org
The cavity perturbation method is a standard technique for material parameter estimation. It
typically assumes that the sample consisting of the material under test (MUT) is small. This …
typically assumes that the sample consisting of the material under test (MUT) is small. This …
A cost-effective W-band antenna-in-package using IPD and PCB technologies
This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-
package (AiP) built using commercially available integrated passive device (IPD), printed …
package (AiP) built using commercially available integrated passive device (IPD), printed …
Wideband radar cross section reduction using a novel design of artificial magnetic conductor structure with a triple‐layer chessboard configuration
R Zaker, A Sadeghzadeh - International Journal of RF and …, 2019 - Wiley Online Library
A novel wideband three‐layer chessboard‐like structure is proposed to reduce the radar
cross section (RCS) of the radar target. This configuration is composed of two artificial …
cross section (RCS) of the radar target. This configuration is composed of two artificial …
3D nanoporous antennas as a platform for high sensitivity IR plasmonic sensing
Nanoporous gold can be exploited as plasmonic material for enhanced spectroscopy both in
the visible and in the near-infrared spectral regions. In particular, the peculiar morphology of …
the visible and in the near-infrared spectral regions. In particular, the peculiar morphology of …
Double‐layer ultra‐thin artificial magnetic conductor structure for wideband radar cross‐section reduction
R Zaker, A Sadeghzadeh - IET Microwaves, Antennas & …, 2018 - Wiley Online Library
A novel double‐layer chessboard‐like configuration is proposed to reduce radar cross‐
section (RCS) in microwave and mm‐Wave bands. This structure is composed of two …
section (RCS) in microwave and mm‐Wave bands. This structure is composed of two …
An ENG-Inspired Microwave Sensor and Functional Technique for Label-Free Detection of Aspergillus Niger
Aspergillus Niger is an airborne fungal pathogen which commonly affects the vegetation.
More importantly, the toxins carried by its micrometer-sized spores can be easily inhaled …
More importantly, the toxins carried by its micrometer-sized spores can be easily inhaled …
[图书][B] Effective medium modeling and experimental characterization of multilayer dielectric with periodic inclusion
T Zhao - 2015 - search.proquest.com
Multi-layered dielectric structures are widely seen in modern semiconductor industry. Their
applications cover multi-scaled areas such as in chips, packagings and printed circuit …
applications cover multi-scaled areas such as in chips, packagings and printed circuit …