A pre-shaped wafer level packing strategy for RF MEMS

[PDF] academia.edu

Development and modeling of a wafer-level BCB packaging method for capacitive RF MEMS switches

I Comart, C Cetintepe, E Sagiroglu… - Journal of …, 2019 - ieeexplore.ieee.org
This paper presents a novel wafer-level packaging method for shunt, capacitive RF MEMS
switches using BCB as the adhesive interlayer. Fabrication and electrical characteristics of …
被引用次数：9 相关文章 所有 6 个版本
[PDF] metu.edu.tr

Packaging of RF MEMS switches and performance improvement

İ Comart - 2019 - open.metu.edu.tr
This dissertation presents a novel zero-level packaging method for shunt, capacitive contact
RF MEMS switches where BCB acts as the adhesive interlayer between the cap and device …
相关文章 所有 5 个版本