This paper reviews recent progress and future directions of signal integrity design for high-
speed digital circuits, focusing on four areas: signal propagation on transmission lines …

This paper reviews the fundamentals and latest progress of modeling, analysis, and design
technologies for signal integrity and electromagnetic compatibility on PCB and package in …

A database is presented that allows the investigation of machine learning (ML) tools and
techniques in the signal integrity (SI), power integrity (PI), and electromagnetic compatibility …

A cascaded S-parameter method is proposed in this paper for signal/power integrity analysis
of multiple vias in a multilayer printed circuit board (PCB). The proposed method enables …

Exact and consistent modeling of circularly shaped ports in the power/ground plane analysis
under the assumption of isotropic excitations is addressed in this paper. Novel expressions …

Via transitions in high-speed channels critically influence the signal integrity and power
integrity of high-speed systems. In this article, a mode-decomposition-based equivalent …

An engineering-informed approach to reduce a feasible design space for printed circuit
board (PCB)-based power delivery networks (PDNs) of high-speed digital systems, is …

A discontinuous Galerkin time-domain (DGTD) method analyzing signal/power integrity on
multilayered power-ground parallel plate pairs is proposed. The excitation is realized by …

This paper studies the accuracy of the physics-based via model, specifically when applied to
dense via arrays. The physics-based model uses Green's functions for cylindrical waves in …

In this third paper of the series, physics-based models are used to develop insight into
practical aspects of the electrical performance of via interconnects in the frequency range up …