Comparison of etch characteristics of KOH, TMAH and EDP for bulk micromachining of silicon (110)
Bulk micromachining in Si (110) wafer is an essential process for fabricating vertical
microstructures by wet chemical etching. We compared the anisotropic etching properties of …
microstructures by wet chemical etching. We compared the anisotropic etching properties of …
Design and fabrication of SOI technology based MEMS differential capacitive accelerometer structure
This paper discusses the design and fabrication of MEMS differential capacitive
accelerometer (z-axis sensitive) structure. The accelerometer structure consists of one each …
accelerometer (z-axis sensitive) structure. The accelerometer structure consists of one each …
Influence of deep reactive ion etching process parameters on etch selectivity and anisotropy in stacked silicon substrates for fabrication of comb-type MEMS capacitive …
This paper presents etching optimization of comb structure formation in small silicon
substrates mounted on a large silicon wafer (150 mm diameter) using the S1818 photoresist …
substrates mounted on a large silicon wafer (150 mm diameter) using the S1818 photoresist …
Effect of vacuum packaging on bandwidth of push–pull type capacitive accelerometer structure
This paper presents the effect of vacuum packaging on the band-width of push–pull type
capacitive accelerometer structure. The accelerometer structure (for±30 g application) …
capacitive accelerometer structure. The accelerometer structure (for±30 g application) …
Diffusion induced residual stress in comb-type microaccelerometer structure
This paper presents the effect of residual stresses due to deep boron diffusion on
microaccelerometer structure. The microaccelerometer structure was simulated at various …
microaccelerometer structure. The microaccelerometer structure was simulated at various …
Lapping assisted dissolved wafer process of silicon for MEMS structures
Dissolved wafer process (DWP) is being extensively used to fabricate complex micro-electro-
mechanical system (MEMS) structures. Etching non-uniformity, increased surface roughness …
mechanical system (MEMS) structures. Etching non-uniformity, increased surface roughness …
Estimation of bending of micromachined gold cantilever due to residual stress
Electroplated gold is widely used as the material for the micromachined beam structures due
to its excellent electrical and mechanical properties. This work attempts to analyze the …
to its excellent electrical and mechanical properties. This work attempts to analyze the …
Characterization of SOI technology based MEMS differential capacitive accelerometer and its estimation of resolution by near vertical tilt angle measurements
Y Parmar, N Gupta, V Gond, SS Lamba… - Microsystem …, 2020 - Springer
This paper discusses the evaluation and testing of MEMS capacitive accelerometer (z-axis
sensitive) fabricated using silicon-on-insulator (SOI) wafer. The accelerometer structure …
sensitive) fabricated using silicon-on-insulator (SOI) wafer. The accelerometer structure …
Comparison of residual stress in deep boron diffused silicon (100),(110) and (111) wafers
Deep boron diffused p++ silicon layer is a powerful tool in determining the thickness of bulk
micromachined MEMS structures. However, due to the large incorporation of boron atoms …
micromachined MEMS structures. However, due to the large incorporation of boron atoms …
Estimation of boron diffusion induced residual stress in silicon by wafer curvature technique
Heavily boron doped silicon layer is being used to control the thickness of the bulk micro-
machined micro-electro-mechanical system (MEMS) based structures. Residual stress …
machined micro-electro-mechanical system (MEMS) based structures. Residual stress …