In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …

Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip
assembly, and underfill will be presented in this study. Emphasis is placed on the latest …

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are
presented in this study. Emphasis is placed on:(A) the package formations such as (a) chip …

Table of contents Chapter 1: Introduction to Environmentally Benign Electronics
Manufacturing Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps …

Several wafer level chip scale package (WLCSP) technologies have been developed which
generate fully packaged and tested chips on the wafer prior to dicing. Many of these …

The design, materials, process, fabrication, and reliability of fan-out wafer-level packaging
(FOWLP) with chip-first and die face-up method are investigated in this paper. Emphasis is …

The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

(57) ABSTRACT A microphone assembly includes a cover, a base coupled to the cover, a
microelectromechanical system (MEMS) device disposed on the base. An opening is formed …

The effects of local electrical contact resistance on transport variables, cooling rate, solute
distribution, and nugget shape after solidification responsible for microstructure of the fusion …

There are at least five different chiplet design and heterogeneous integration packaging,
namely (1) chip partition and heterogeneous integration (driven by cost and technology …