Measurement uncertainties of a CMOS-based piezoresistive stress sensor are studied for
low cycle thermal loading applications. After the fundamentals of the sensor are reviewed …

This paper proposes a new hybrid temperature compensation system for doped silicon-
based piezoresistive 3D stress sensors. The developed compensation system integrates a …

A single-polarity (n-type) piezoresistive sensing chip for three-dimensional (3D) stress
sensing has been microfabricated and fully calibrated. The sensing chip, which is capable of …

Numerical and experimental sensitivity analyses in this paper indicate that the accuracy of a
silicon multi-element piezoresistive (PR) stress sensor can be dramatically influenced by the …

With increasing importance of 3D packaging systems, more and more dies will be stacked
on top of each other and connected using through silicon vias (TSVs) and solder bumps. In …

Passive stress sensors have been integrated in a silicon interposer test vehicle to
investigate thermo-mechanical stress in a typical 2.5 D system. The present sensors are …

Flip chip packaging system consists of different materials in the connecting parts, and has an
undesirable stress distribution on the chips. Large residual strain will lead to a deterioration …

This work involves the design, microfabrication, calibration, and testing of a new silicon-
based piezoresistive rosette capable of extracting the three-dimensional (3D) stresses in the …

This dissertation presents a new approach to prognostics and health monitoring for
automotive applications using a piezoresistive silicon stress sensor. The stress sensor is a …

Stacked chip packaging (3D packaging) is an effective method to increase the density of
electronic packaging, due to the packaging density on an single chip has reached the limit of …