A multilayered antenna package including: a radio frequency integrated circuit (RFIC)
interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric …

(57) ABSTRACT A semiconductor package including a top-surface metal layer for
implementing circuit features provides improvements in top-surface interconnect density …

A semiconductor package including top-surface terminals for mounting another
semiconductor package provides a three-dimensional circuit configuration that can provide …

A semiconductor package including top-surface terminals for mounting another
semiconductor package provides a three-dimensional circuit configuration that can provide …

(57) ABSTRACT A system and method is disclosed for measuring time of flight to an object.
A transmitter transmits an electromag netic signal and provides a reference signal …

Disclosed are a semiconductor device capable of efficiently radiating heat of a
semiconductor die and a method of fabricating the same. The semiconductor device …

(57) ABSTRACT A method of manufacturing a semiconductor package includes mounting
and electrically connecting a semiconduc tor die to a substrate. The semiconductor die and …

A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level
RDL die assembly mounted to the substrate and a second level RDL die assembly mounted …

Tunable impedance matching networks and tunable diplexer matching systems are
provided. A tunable impedance match ing network can include an impedance element …

A variable capacitor device using MEMS or micromachining techniques wherein thin-films of
materials are deposited, patterned and etched to form movable micromechanical elements …