The concept of chemical mechanical planarization (CMP) was invented in IBM in the early
1980s by Klaus D. Beyer in an attempt to create a highly planar surface and enable …

This paper reviews the mechanical and fracture properties of porous ultralow-k dielectrics
with the focus on chip package interaction related issues. It is shown that the mechanical …

Continued reduction in resistance-capacitance (RC) delays in nano-electronic Cu
interconnect structures will require new materials with increasingly lower dielectric constants …

Among various low-dielectric constant (low-k⁠) materials under development, organosilicate
glasses (OSGs) containing nanometer-size pores are leading candidates for use as …

Water adsorption in porous low-k dielectrics has become a significant challenge for both
back-end-of-line integration and reliability. A simple method is proposed here to achieve in …

The mobility of organic molecules under nanoscale confinement differs greatly from that in
the bulk. In this study we show that the conventional free volume dependent mobility …

The integration of nanoporous organosilicate thin films involving chemical mechanical
planarization (CMP) is a significant challenge due the evolution of defects in the films during …

Organosilicate (OSG) low dielectric constant films containing different concentrations of 1, 3-
and 1, 3, 5-benzene bridges between Si atoms are fabricated using 1, 3, 5-tribromobenzene …

The reliable integration of nanoporous low dielectric constant (k) materials is challenging
due to their vulnerability to delamination, cohesive cracking, and diffusion. We review …

The diffusion of water in nanoporous organosilicate glass (NPOSG) film stacks causes
significant adhesion degradation of the capping layer on top of the NPOSG. We have used …