Ultra‐thin flexible encapsulating materials for soft bio‐integrated electronics

M Sang, K Kim, J Shin, KJ Yu - Advanced Science, 2022 - Wiley Online Library
Recently, bioelectronic devices extensively researched and developed through the
convergence of flexible biocompatible materials and electronics design that enables more …

Anti-fouling/wetting electrospun nanofibrous membranes for membrane distillation desalination: A comprehensive review

MO Aijaz, MR Karim, MHD Othman, UA Samad - Desalination, 2023 - Elsevier
The membrane distillation (MD) process has been identified as one of the most promising
technologies in seawater desalination and wastewater treatment due to its lack of a salinity …

Heterostructured BN@ Co‐C@ C endowing polyester composites excellent thermal conductivity and microwave absorption at C band

X Zhong, M He, C Zhang, Y Guo… - Advanced Functional …, 2024 - Wiley Online Library
The trends of miniaturization, lightweight, and high integration in electronics have brought
serious issues in heat dissipation and electromagnetic compatibility and also limited the …

[HTML][HTML] Highly efficient thermal conductivity of polydimethylsiloxane composites via introducing “Line-Plane”-like hetero-structured fillers

S Wang, D Feng, H Guan, Y Guo, X Liu, C Yan… - Composites Part A …, 2022 - Elsevier
Graphite oxide (GO) and cetyltrimethylammonium bromide (CTAB) modified multi-walled
carbon nanotubes (m-MWCNTs) are utilized to fabricate “Line-Plane”-like hetero-structured …

Soft and self‐adhesive thermal interface materials based on vertically aligned, covalently bonded graphene nanowalls for efficient microelectronic cooling

Q Yan, FE Alam, J Gao, W Dai, X Tan… - Advanced Functional …, 2021 - Wiley Online Library
Urged by the increasing power and packing densities of integrated circuits and electronic
devices, efficient dissipation of excess heat from hot spot to heat sink through thermal …

Co-manipulation of defects and porosity for enhancing the electrical insulation, microwave absorbing/shielding, and thermal properties of filter-paper-derived 2D …

L Xing, H Xia, K Shen, C He, Y Yang, G Tong, T Wu… - Carbon, 2023 - Elsevier
To develop light-weight polymer-based multifunctional materials with outstanding
electromagnetic wave absorbing/shielding properties and high thermal conductivity, 2D …

Miniature coiled artificial muscle for wireless soft medical devices

M Li, Y Tang, RH Soon, B Dong, W Hu, M Sitti - Science advances, 2022 - science.org
Wireless small-scale soft-bodied devices are capable of precise operation inside confined
internal spaces, enabling various minimally invasive medical applications. However, such …

[HTML][HTML] Stress induced carbon fiber orientation for enhanced thermal conductivity of epoxy composites

M Li, Z Ali, X Wei, L Li, G Song, X Hou, H Do… - Composites Part B …, 2021 - Elsevier
Polymer composites that have high thermal conductivity have become one of the most
promising solutions needed to satisfy the thermal management requirements for high-power …

Thermal conductivity enhancement of carbon fiber/epoxy composites via constructing three-dimensionally aligned hybrid thermal conductive structures on fiber …

M Hao, X Qian, Y Zhang, J Yang, C Li, H Gong… - … Science and Technology, 2023 - Elsevier
Owing to high graphitization degree, polyacrylonitrile (PAN)-based high modulus carbon
fiber (HMCF) can not only be used as the general structural reinforcement for advanced …

Ultrahigh thermal conductive polymer composites by the 3D printing induced vertical alignment of carbon fiber

Z Zhang, M Li, Y Wang, W Dai, L Li, Y Chen… - Journal of Materials …, 2023 - pubs.rsc.org
As the power density increases in electronic devices, requirements for high-performance
thermal interface materials that can efficiently bridge the heat transport channel between the …