Tin–lead solder alloys are widely used in the electronic industry. They serve as
interconnects that provide the conductive path required to achieve connection from one …

Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip
assembly, and underfill will be presented in this study. Emphasis is placed on the latest …

This classic reference examines the mechanisms driving adhesion, categories of adhesives,
techniques for bond formation and evaluation, and major industrial applications. Integrating …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

1420 arate from the substrate upon being subjected to a sudden shock (13, 14). The impact
strength of conductive adhesives may be increased by decreasing the filler loading, using …

This book provides in-depth coverage of environmental pollution sources, waste
characteristics, control technologies, management strategies, facility innovations, process …

Explores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators,
and Practitioners in the FieldWhy use smart materials? Since most smart materials do not …

Fundamental, physics-based modeling of complex food processes is still in the
developmental stages. This lack of development can be attributed to complexities in both the …

With the development of science and technology, consumers' requirements for various
electronic devices present a trend of more diverse functions and thinner bodies. This makes …

Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …