Recent Progresses and Perspectives of UV Laser Annealing Technologies for Advanced CMOS Devices
T Tabata, F Rozé, L Thuries, S Halty, PE Raynal… - Electronics, 2022 - mdpi.com
The state-of-the-art CMOS technology has started to adopt three-dimensional (3D)
integration approaches, enabling continuous chip density increment and performance …
integration approaches, enabling continuous chip density increment and performance …
Microsecond UV laser annealing annihilating Ru grains smaller than electron mean free path
L Lu, N Jourdan, R Daubriac, T Tabata… - … (IITC) and IEEE …, 2023 - ieeexplore.ieee.org
Enlarging metal grain size over electron mean free path is one of the ways to reduce
resistivity in BEOL interconnect because it suppresses electron scattering at grain …
resistivity in BEOL interconnect because it suppresses electron scattering at grain …